Author: Miha Čekada, Peter Panjan, Dalija Jurić, Janez Dolinšek, Anton Zalar
Institute: Jozsef Stefan Institute, Jamova 39, SI-1000 Ljubljana, Slovenia
The deposition and characterization of Al–Cu–Fe thin films is an important area of research in materials science. Thin films composed of aluminum, copper, and iron alloys are studied due to their unique physical and chemical properties, which make them promising for applications in microelectronics, solar cells, and other high-tech devices.
The process of applying such films can be carried out by various methods, including magnetron sputtering, chemical vapor deposition and laser deposition. Each of these methods has its own characteristics, allowing to control the thickness, structure and morphology of the obtained films. An important aspect is also the study of the influence of temperature conditions and the atmosphere of the environment on the properties of the films.
Multilayer thin Al/Cu/Fe films were produced using the sputtering method in a triode system in various combinations. After deposition, the samples were annealed in an inert atmosphere at a temperature of up to 600 °C, which made it possible to achieve a homogeneous film with the composition AlCu25Fe13. This was achieved due to the correct ratio of layer thicknesses and the optimal annealing temperature. Depth profiling using AES was used to study the diffusion processes in the film. X-ray diffraction analysis showed the presence of binary AlCu3 and ternary β-AlCuFe phases, which depended on the annealing temperature. The formation of these phases is associated with an increase in microhardness and specific electrical resistance.
The Al–Cu–Fe system has attracted much interest since the discovery of the icosahedral quasicrystalline phase in a narrow concentration range. Although the bulk materials have been well studied, the study of thin films remains in its infancy. There are three methods to deposit quasicrystalline thin films by PVD, including segmental sputtering, evaporation from different sources, and the creation of multilayer films followed by annealing to achieve homogeneity. Depth profiling during annealing is critical to understand the processes. X-ray diffraction, as well as microhardness and electrical resistance, will be used to analyze the structure and properties of the films. The aim of this work is to prepare Al/Cu/Fe multilayer films, anneal them using different methods, and measure the physical properties at different stages.
Characterization of thin films involves the analysis of their mechanical, electrophysical and optical properties. Such studies not only contribute to the understanding of fundamental processes occurring in the material, but also open up new horizons for the development of innovative technologies in the field of nanoelectronics and functional coatings.